Krishna Seshan

Handbook of Thin Film Deposition

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Produktdetails

Verlag: William Andrew
Erschienen: 2012
Sprache: English
Infos: 233 mm x 160 mm
ISBN: 978-1-4377-7873-1

Inhaltsverzeichnis

Foreword to the Third Edition

Scaling of Devices and Thermal Scaling

PVD - Special Topics

CVD New Developments

CVD Equipment

CMP Method and Practice

Process Technology for Copper Interconnects

Optical Thin Films

Thin Films in Photovoltaics

Thin Films in Memory Applications

Index

Langtext

The Handbook of Thin Film Deposition is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, new materials for memory applications and methods for thin film optical processes. In a major restructuring, this edition of the handbook lays the foundations with an up-to-date treatment of lithography, contamination and yield management, and reliability of thin films. The established physical and chemical deposition processes and technologies are then covered, the last section of the book being devoted to more recent technological developments such as microelectromechanical systems, photovoltaic applications, digital cameras, CCD arrays, and optical thin films.

Über den AutorIn

Former Assistant Professor in Materials Science at the University of Arizona with extensive professional experience as a technologist at both IBM and Intel Corporations. Dr. Seshan passed away in 2017.

abrasive(s) alumina aluminum argon Atomic layer deposition barrier layer base pressure batch tooling capacitor cathode fall cathode sheath CdTe (cadmium telluride) charge trap Chemical mechanical polishing Chemical vapor deposition CIGS (copper indium gallium sulfide) CMOS collimation collision cascade collisional ionization contact resistance conversion efficiency copper electrochemistry Copper interconnect cosine sputtering law cryopump Cu-CMP damascene dark space degas deposition deposition equipment diode sputtering plasma directional deposition DRAM drift velocity dual damascene dual stress liner electromigration energy conversion film metrology CVD flash flash scaling four-point probe gate oxide scaling grit blasting heat generation Heat generation from microprocessors history of chemical vapor deposition hollow-cathode magnetron hysteresis interference filters ionized sputtering knock-on sputtering leakage current scaling limits load lock low-k dielectric magnetron mainframe metal gates microloading modeling multilayer films NAND nitridization nitrogen nonlinear cascade optical absorbers optical coating manufacture Optical coatings optical films optical filters oxygen package design packaging and chip cooling pattern effects in CVD pedestal bias Photovoltaic physical vapor deposition picosecond ultrasound planarization planetary tool plasma flame spraying plasma potential plasma-enhanced CVD power radio frequency (RF) sputtering radio frequency coil reactive clean reactive sputtering reliability effects residual gas analysis resistivity Scaling scaling and heat generation Scaling of transistors secondary electrons self-sustained sputtering semiconductor shallow trench isolation sheet resistance shielding silicon silicon CMP silicon oxide and silicon nitride film properties silicon strain metrology SOI materials and advantages solar cells sputter etching sputter yield Sputtering step coverage strained CMOS devices stress in thin films stress memorization technique stress-induced voids tantalum tantalum nitride thermal interface materials thin film threshold energy time-dependent dielectric breakdown titanium nitride trench turbopump UV cure (effect on intrinsic film stress) vacuum cluster tooling variability via X-ray fluorescence X-ray reflectance